ASX

Symbol	last price	date	time	change	open	high	low	volume	P/E (ttm)	P/E (Forward)
ASX	3.56	9/2/2010	3:07pm	+0.06	3.53	3.56	3.51	248223

Summary

Advanced Semiconductor Engineering, Inc., together with its subsidiaries, provides semiconductor packaging and testing services for semiconductor companies. Its services include semiconductor packaging; design and production of interconnect materials; front-end engineering testing; and wafer probing and final testing services. The company offers various leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier, and quad flat no-lead package; and package types based on substrates, such as flip-chip BGA and other BGA types, as well as wafer-bumping products. Its testing services include front-end engineering testing, wafer probing, and final testing of logic/mixed-signal and memory semiconductors, as well as other test-related services, such as burn-in testing, dry pack, and tape and reel. The company packages and tests a range of products for use in various end-use applications, including communications, personal computers, consumer electronics, industrial, automotive, and other applications. It has operations in Taiwan, Korea, Malaysia, Singapore, Japan, the People's Republic of China, the United States, Austria, Belgium, and Germany. The company was founded in 1984 and is based in Kaohsiung, Taiwan.