ASTT

Symbol	last price	date	time	change	open	high	low	volume	P/E (ttm)	P/E (Forward)
ASTT	0.00	N/A	N/A	N/A	N/A	N/A	N/A	N/A

Summary

ASAT Holdings Limited provides semiconductor package design, assembly, and test services. It offers chipscale packages that include Fine Pitch BGA, which is used in a range of device applications such as memory, application specific integrated circuits, logic, analog, RF devices, and small programmable logic devices; leadless plastic chip carrier for use in mobile communications, particularly cell phones, analog to digital circuits, digital to analog circuits, and the power management circuits used in consumer electronics; and Thin Array Plastic Packaging, which provides metallic contacts to the circuit board allowing high density circuitry in a small footprint package. The company also provides Non-CSP laminate packages comprising Plastic BGA packages; Tape BGA packages that offer thermal management and enhanced electrical performance using a flexible circuit substrate bonded to a copper plate; and flip chip packages that use solder balls to connect to the printed circuit board. In addition, it offers Non-CSP leadframe packages are used in electronics applications, including automobiles, household appliances, desktop and notebook computers, and telecommunications products. Further, the company provides test services for digital logic, analog, mixed signal, and RF products. It has operations primarily in Hong Kong, the United States, and China. The company was founded in 1999 and is headquartered in Tsuen Wan, Hong Kong.